Special Issue of ICBAKE2023: Call for Extended Papers of ICBAKE2023

October 12, 2023
Special Issue of ICBAKE2023: Call for Extended Papers of ICBAKE2023

Special Issue of ICBAKE2023:
Call for Extended Papers of ICBAKE2023 (International Conference on Biometrics and Kansei Engineering 2023).

A forthcoming volume of the International Journal of Affective Engineering (IJAE) will be published as a Special Issue of Biometrics and Kansei Engineering. This Special Issue aims to discuss new theories and applications related to “Kansei” in the Biometrics and Kansei Engineering field.
This Special Issue solicits extended paper submissions from authors who presented their original works in the ICBAKE2023, which was held as a part of CISIM2023, September 22-24, 2023.

The authors are requested to submit a manuscript that contains 5 to 10 printed pages. All manuscripts must be prepared per the IJAE’s Rules for Publication. For more information on the submission, please read over the descriptions on the website below:
For paper submissions, use our reviewing system, the editorial manager (EM), by logging in to this website. With this system, the authors can check the progress of the paper review.
In the EM, the authors choose “Original Article” in the Article Type and upload your paper. Please choose “Special Issue on ICBAKE” in Section/Category. The paper format for submission is limited to Adobe PDF.

For paper submission, we request authors to add one cover letter that includes
(1) The paper title and authors’ names, contact information with e-mail address, and abstract of the paper.
(2) Details of any consent and/or ethics approvals.
(3) The description briefly clarifies the difference between the already published paper in CISIM2023 proceedings and the submitted paper for this Special Issue.

The authors should revise and submit the manuscript considering the following guidelines:
(1) change the title from the already published paper in CISIM2023 proceedings.
(2) cite the already published paper, and a copy of the paper should be included in the submission.
(3) revise the already published paper and make its content different by more than 40%.

Deadline of paper submission : December 31, 2023.

If the prospective authors have any questions, please contact the editors of the special issue:
Makoto Fukumoto (E-mail: fukumoto@fit.ac.jp), Fukuoka Institute of Technology
Jun-ichi Imai (E-mail: imai@cs.it-chiba.ac.jp), Chiba Institute of Technology
Akihiro Ogino (E-mail: ogino@cc.kyoto-su.ac.jp), Kyoto Sangyo University
Kaori Yoshida (E-mail: kaori@brain.kyutech.ac.jp), Kyushu Institute of Technology

| 2023/10/12